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March 2000

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 16 Mar 2000 10:54:21 +1100
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dead right with that humor & the rest of it Frank ;
JUST i'd have my doubts about that "buff off" method :
planar? even? measurable? on pads? copper/nickel(hard) edges exposed? ;
can smell some of those marzipan's set in traps to keep the vermin down .

~...hmmmm, wondering too ; how does the inventor Franklin (behold Ben's
name)DO this ?
Didn' mean to tickle yo' ok ?
just genuanielee curious
And tell me you CAN keep windows like 6-10u"Au upon specs ,
i'll route you our entire bare card turnover .

paul

-----Original Message-----
From: Franklin Asbell [mailto:[log in to unmask]]
Sent: Thursday, 16 March 2000 12:01
To: [log in to unmask]
Subject: [TN] Gold Removal


Cyanide in and of itself won't remove gold, it's a lot more detailed than
that, and then controlling how much is removed is almost impossible.

Speaking from experience, you won't even smell almonds, you might see a
humid cloud drifting slowly away from the tank, and the next thing you'll
see is the ER doctor telling you things will be just fine.

30 microinches of Gold won't affect solderability any different then 10
microinches. What it might affect depending on your application is the
electrical properties.

If 30 microinches is simply intolerable then buff the gold tabs or pads down
to what you believe to be a tolerable level, unless you have access to an
XRF or similar device though, you won't know how far you've gone.

Sure, reject it all back to the fabricator, have them restart the job, put
everything on a back burner, or better yet, find another supplier, resubmit
gerber, have them do it, of course you'll want to survey them first, gotta
remember to schedule that before we give them the order.

~...hmmmm, wondering if I'm being too facetious, nah, not with this group,
they can appreciate the humor in this....grinning~

Franklin

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