I agree with this.  Do the math.  If a five mil stencil is used, and the
component leads are NOT gold plated, the board gold thickness can reach
nearly 75 micro inches before the percentage of gold in the joint reaches
the magical number of 3%.  Below 3%, gold is not shown to induce
embrittlement.  If you are soldering to BGA balls, there is even more Tin to
dilute the gold, so the gold thickness can be even thicker.  The reason for
the 5 to 8 micro inches of gold thickness is, that is the MINIMUM needed to
prevent oxidation of the nickel.  Thicker gold is more expensive in terms of
processing and material cost, and it is unnecessary, so why do it?

Of course, if I buy a new stereo, and it has a scratch on it, I'll take it
back.  Functionality be damned.  Rick can do the same with his boards.

Ryan G.

> -----Original Message-----
> From: Timothy Reeves [SMTP:[log in to unmask]]
> Sent: Wednesday, March 15, 2000 3:08 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] ??: [TN] Gold Removal
>
> Does anyone agree with this? I hope not.
>
> > ----------
> > From:         Jonathan A Noquil
> > Sent:         Tuesday, March 14, 2000 15:57
> > Subject:      Re: ??: [TN] Gold Removal
> >
> > Higher gold thickness does not affect
> > reliability (solderability),
>
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