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March 2000

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Subject:
From:
Hinners Hans Civ WRALC/LYPME <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 1 Mar 2000 14:00:44 -0500
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Hi Brent,

It may not be the Plating line but the Drill causing trouble.  Our tool crib
started stocking various suppliers' bits for different sizes without telling
anyone in Manufacturing.  Hole walls showed huge chunks gouged out.

Hans


~~~~~~~~
Hans M. Hinners
Materials (& Process!) Engineer
Warner Robins - Air Logistics Center/Avionics Production Division
Manufacturing Branch (LYPME)
380 Second Street, Suite 104    (Building 640)
Robins AFB, GA  31098-1638
912-926-1970 (Voice) 468 - 1970 (DSN)  912-926-7164 (Fax)
mailto:[log in to unmask]

> -----Original Message-----
> From: Brent Mayfield [SMTP:[log in to unmask]]
> Sent: Wednesday, March 01, 2000 12:25
> To:   [log in to unmask]
> Subject:      [TN] Plating small diameter vias in multilayer flex
>
>
> I am having some difficulty plating .008" holes in an 8-layer polyimid
> flex.  I am using Dupont Pyralux, and the board thickness is ~.025.  I
> have tried numerous alkaline pre-treaments in addition to Dupont's
> recommended plasma cycle,  but cannot seem to get rid of electroless
> copper voids.  Anyone have experience with this?
>
> Brent Mayfield
> Flexible Circuit Products Manager
> Compunetics, Inc.
> Advanced Interconnect Products Division
> [log in to unmask] <mailto:[log in to unmask]>
> www.compunetics.com <http://www.compunetics.com>
> Phone: (412) 858-6148
> Fax: (412) 373-4184
>
> If a man has come to that point where he is so content that he says; I do
> not want to know any more, or do any more or be any more, he is in a state
> of which he ought to be changed into a mummy.
> Henry Ward Beecher
>
>

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