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March 2000

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Subject:
Re: Gold Removal
From:
Chuck Brummer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 Mar 2000 15:10:41 -0800
Content-Type:
text/plain
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text/plain (51 lines) 
Whats the matter, free gold is a good thing for you, bad for your supplier.  Ha Ha.
No really, what is the problem, it will not interfere with wire bonding or solder?  It
is not enough to create an insertion problem.

If you really have to you can burnish it off.

Chuck Brummer
Acuson

"Hollandsworth, Ron" wrote:

> Rick Howieson & Others:
> Rick, you ask how thick our gold was . . . I misled everyone in the type of
> plating . . . it's not immersion but rather electroplating.  Our spec is
> 6-10 and we are getting or got, 20-30 on some boards.  These are the boards
> we would like to remove some gold if possible.
>
> I understand that electroplating your thickness depends on time rather than
> ion for ion in immersion plating.
>
> Thanks
> Ron
>
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