We are a Flex-circuit manufacturer.  We commonly hand solder pins with a flat head into plated thru-holes.  In reviewing IPC-A-610C and J-STD-001, we found no clear criteria for the appearance of this type of joint.  Some customers rely on standard thru-hole criteria of 330 degrees of fillet around the head of the pin (source side) and 270 degrees of wetting on the pin side (destination side).  This is not always achievable due to blockage of the hole with the pin head.

Any help in interpretation of these specifications would be appreciated along with any known techniques for a repeatable joint. Similar issues involve swaged (roll-over or flared) pins.  These have a hole in the center which are typically mis-interpreted as a pin holes.

Regards,
Dave Kell
Minco Products, Inc.

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