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March 2000

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Subject:
From:
Jeff Hempton <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 Mar 2000 10:27:55 -0500
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     Hi Technetters,
       We are researching moving away from plugging our vias with solder
     mask (problems and reliability issues) and plugging with solder thru
     the wave solder process.
     I have read all of the archives, and printed a major novels worth
     (thanx for past info group, those archives are a wealth!!) bit one
     item is still missing I hope you can respond with info on:

     ASSY: Do you have problems with, or design guidelines that address,
     the solder filled vias under components, or is this even an issue?

     FAB: How do most of your customers address this?

     Please, deluge me with your wisdoms, responses and help on this issue.
     Thanx in advance group.

     Jeff Hempton, Sr. SMD Mfg. Engineer
     United Technology Electronic Controls
     e-mail:   [log in to unmask]

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