What a smooth reentry to atmosphere,
just the right angle ; welcome back Bev.
Indeed the xyzX is good and expensive way to see.
Still , as some (Phil Zarrow wrote even that neat article somewhere)of us
here concur,
pound for pound the ersascope beats it all in versatility .
Perhaps you just momentarily forgot to mention this one mate .
Chris , you could go to my or Steve's rethorics in archives , it sits there
(incl. Phil's unusually glowin' review)
For that die and pry method yo mentioned :
you can make a simple cam tool with narrow teardrop profile;
whereas the edge wedges under BGA, and rounds rotate/slide(polished)for
lift,
double sided easy, four sided more involved (basically doubling the double
with linked levers).
(by the way this is a public domain release, toolmakers go for it :
means no nitwit can patent/lock it after today, send me bottle when you make
A money of it)
Paul Klasek
ResMed
PS
as one of our ingenious members also pointed out ,
used dentists Xheads may provide $ sensible alternative.
-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Friday, 10 March 2000 6:01
To: [log in to unmask]
Subject: Re: [TN] How do you assess BGA to PCB solder quality?
Chris,
Good to hear from you, even if it is indirectly through TechNet.
There is no documented industry standard test for BGAs. The closest thing
to what you are talking about is the near universal use of X-ray inspection
- when people have the $ to buy a system. 2D systems will of course let you
see missing balls (rare), small solder balls (from solder paste), errant
chip caps, shorts (poor paste placement, smeared paste from poor part
placement, pop-corned BGA) and voiding (% level before things are "bad"
still up for discussion). Detection of opens is somewhat problematic. This
is something that the 3D systems really have it over the 2D ones.
Individual companies also have tests for shearing whole BGAs off boards,
shear testing of individual balls off of virgin parts and I have heard of
one test involving prying off the part and using dye for crack detection.
Bev Christian
Director of Electronics Manufacturing
XLTEK
2568 Bristol Circle
Oakville, Ontario
L6H 5S1
1-800-387-7516
Cell 905-334-2993
FAX 905-829-3561
-----Original Message-----
From: Chris Windsor [mailto:[log in to unmask]]
Sent: March 9, 2000 10:32 AM
To: [log in to unmask]
Subject: [TN] How do you assess BGA to PCB solder quality?
Does anyone know of a industry standard test and criteria for assessing the
quality of BGA-to-PCB solder joints? What I'm looking for is something
quick, like a pull or shear test.
Chris Windsor
Member of Technical Staff
Microelectronics & Computer Technology Corp. (MCC)
3500 W. Balcones Center Dr.
Austin, TX 78759
ph 512-338-3575
fax 512-338-3814
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