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March 2000

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Subject:
From:
Chris Windsor <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 9 Mar 2000 09:32:19 -0600
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Does anyone know of a industry standard test and criteria for assessing the quality of BGA-to-PCB solder joints? What I'm looking for is something quick, like a pull or shear test.

Chris Windsor
Member of Technical Staff
Microelectronics & Computer Technology Corp. (MCC)
3500 W. Balcones Center Dr.
Austin, TX  78759
ph  512-338-3575
fax 512-338-3814

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