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March 2000

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Subject:
From:
Jorge Engenharia <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 1 Mar 2000 11:50:14 -0500
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   Jim

   I believe in this case the practice will be worth then theory. Why not
take a sample board and pass trough the reflow oven without the glue and see
what happens ? Even with theory you will have to check if it really works
doing the same thing. All situations where the force is near of the
theoriticall value ( plus or minor ) you also have to check because theory
and practice not always are the same ...
  I hope this help.
Jorge Dourado de Santana
Maintenance / Process Engr
Microtec - Brazil



> -----Original Message-----
> From: Jim Faulkner [SMTP:[log in to unmask]]
> Sent: 1 de Março de 2000 13:00
> To:   [log in to unmask]
> Subject:      [TN] Double sided reflow
> 
> I am looking for an equation that calculates the holding force of solder
> paste for a given component.  Meaning the holding force required to hold a
> part on a board during bottom side reflow for SMT.  We are trying to
> determine when we need to glue.  As of right now we glue most of our
> components to the board but would like to reduce that number.  Any
> information you could share with me on this would be greatly appreicated.
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