oH , Wade, below the belt with dispensing , lady to top it, shame on you .
Stella , the temporal gentlemen's advice :
as yo don't have the dispenser (male's fetishisms are just deplorable) ;
go with a nice fellow like Steve:
you can easily open up the offending orifice in the central axis
(to keep the back seep upon liquidus even) ;
we validated paste even 2-3mm past pad on mask ,
seeped back to joint without any balls whatsoever ;
should be easy for you , all the center post needs is a double fill,
by the sound of it . Teardrop or oval .
cheers paul
-----Original Message-----
From: Oberle, Wade [mailto:[log in to unmask]]
Sent: Thursday, 9 March 2000 4:00
To: [log in to unmask]
Subject: Re: [TN] Coplanarity
If you have a dispenser in-line with your process, deposit additional solder
paste to the pad or pads that are needed.
Wade Oberle
Artesyn Communications
-----Original Message-----
From: Stella Neyman [mailto:[log in to unmask]]
Sent: Wednesday, March 08, 2000 10:19 AM
To: [log in to unmask]
Subject: [TN] Coplanarity
Dear Technetts,
I have one custom design three leg SMT component. Two side leads (which are
pretty massive and one middle center post). These leads are designed to
create butt joints.
Drawing specifies 0.004" coplanarity for all three leads. We are using
0.007" stencil.
Now $1,000 question. I am using my life line and asking audience to help me.
It seems, that center post doesn't create good solder joint. There are
cases, when it seats only 0.001" deep in the solder and may break easily.
I cannot use more than 0.007" stencil due to other component packages. I
don't want to touch up each solder joint after reflow.
What would you recommend? Please advise.
Sincerely,
Stella
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