Hi Jim,

If you go to the IPC web-site, you will find this subject has come up
before.  Just click on the  link below and goto Email Forum Archives, then
TechNet, then Search the Archives, type in your subject, and you will find
what you are asking about.

http://www.ipc.org/html/fsresources.htm

Jim



-----Original Message-----
From: Jim Faulkner [mailto:[log in to unmask]]
Sent: Wednesday, March 01, 2000 11:00 AM
To: [log in to unmask]
Subject: [TN] Double sided reflow


I am looking for an equation that calculates the holding force of solder
paste for a given component.  Meaning the holding force required to hold a
part on a board during bottom side reflow for SMT.  We are trying to
determine when we need to glue.  As of right now we glue most of our
components to the board but would like to reduce that number.  Any
information you could share with me on this would be greatly appreicated.
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