I've been using .200" around BGA's.
However - We have broken that rule and
placed decoupling caps within the .200
keepout (only for designs with comp.
on top side).

The contract manufacturer know to remove
the caps before reworking the BGA - remember
only caps! No ICs or large tantulums. If the design
has component on both sides then keeping the
.200 keep out shouldn't be an issue.

My 2 cent.

Dennis Ward
Net To Net Technologies

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