In a message dated 3/7/00 11:33:03, [log in to unmask] writes:
>Do you know how to over come the enhanced Z-axis CTE and the problem of
>cracked vias?
Hi Edwin,
The answer is: yes. Get a copy of IPC-D-279 and read Appendix B. More direct
and detailed information is presented in my tutorial:"Manufacturing and
Reliability Issues of Small Diameter/High-Aspect Ratio Plated Through Holes
and Vias" to be given at IPC Expo. you can get the outline at my web site.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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