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March 2000

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 8 Mar 2000 09:14:53 EST
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Hi All!

Maybe some of you remember quite a while back, I had a problem with some 
boards with the soldermask flaking off all the copper after 3-cleanings in 
our MCS-1000. It's basically a fancy-smancy batch cleaner. We use Kyzen 
Aquanox XJN at between a
25-30% concentration (recommended by Kyzen). We also run our wash temps at 
140º F., and our rinse at 120º F.

Back when it happened last time we narrowed things down to the soldermask not 
being able to take the Aquanox, it was a dry-film (Dynachem Dynamask). We had 
other boards that had dry-film on them that we built and showed no 
ill-effects from the cleaning. I looked into things and learned that these 
boards were masked with a Dupont 8100 series dryfilm...so made it a point to 
specify Dupont dry-film on the boards that require dry-film.

Well guess what? I'm starting to see the problem again. Our fab vendor swears 
up and down they used a Dupont dry-film. What I see, is that after the second 
wash the mask will start to "bubble" and lift on the vias (and sometimes the 
traces too), the film hasn't broken yet (it's still intact, it appears to 
just be lifting from the copper), but after you wash the board the third 
time, the mask starts flaking off all the copper... vias, traces, everywhere.

So I guess I'm starting to wonder now if it's really a mask compatibility 
issue with the Aquanox, or is it possibly something about  the quality of the 
surface prep prior to solder masking?

Have any of you seen this before?

Thanks!

-Steve Gregory- 

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