I am looking for an equation that calculates the holding force of solder
paste for a given component.  Meaning the holding force required to hold a
part on a board during bottom side reflow for SMT.  We are trying to
determine when we need to glue.  As of right now we glue most of our
components to the board but would like to reduce that number.  Any
information you could share with me on this would be greatly appreicated.
______________________________________________________
Get Your Private, Free Email at http://www.hotmail.com

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################