Hi,

   I am currently working with Atotech horizontal Copper pulse plating proccess
      with inert anode.



   Anybody have the experience with this process with leveller I, II , III or H6
      especially regarding

   bath stability?  Any reliability and throwing power data available ?



   What is the forward, average and reverse current density used ?



   What is the frequency of carbon treatment ?



   What is the operating range of brightener and leveller ?



   What is the operating speed and the plating thickness achieved ?



   What process preceeds the pulse plating process (e.g. E'less Cu, DM or
      others) ?



   Thank you and with best regards

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################