In acknowledgement to Mike Fenner's response on this subject on Feb 29th -

It is possible the blue ceramic material you witnessed was a DuPont Low
Temperature Co-Fired Ceramic (LTCC) tape material.

We use it extensively, and have no problem with automatic wire bonders
discerning reference points on the 'ceramic'.

Our wireless component customers have used many boxcar loads of this
product, but I can not confirm the type of alignment mechanism utilized
(some are BGA-like attachment, while others utilize peripheral attachments
similar to leadless ceramic chip carriers).  However, receiving no
complaints is usually a good sign.

Am currently working with Philips ACM equipment on flip chip placement on
the blue LTCC substrate.  If I have a problem - surely you will hear the
scream from there!

Steven Creswick
CTS RF Integrated Modules
W. Lafayette, IN  47906

Ph (765) 463 2565

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