Dear colleague,
IPC-6016, Quality and Performance Specification for High Density Interconnect (HDI) Layers or Boards, has been a published specification since May 1999. To date we have not received significant feedback from users on the usefulness of this document.
Because HDI and microvia technologies are constantly evolving, IPC plans to keep this document as current as possible. In order to do so, Dave Vaughan, Taiyo America, Inc., HDI/Microvia Performance Subcommittee (D-43) chair, is asking you, the users of this document, to provide your feedback on its usability and technical accuracy in preparation for the D-43 subcommittee meeting, Tuesday, April 4, 8:00 a.m. to 12:00 p.m., at IPC Printed Circuits Expo in San Diego.
We are asking OEMs and users of HDI boards to provide relevant performance requirements to update the End Use Application Slash Sheets found in Appendix A of the document. We are also seeking information on quality performance specifications for HDI boards made with non-conventional technologies including ALIVH, conductive ink technologies, etc.
If you have any recommendations for revisions or new information you would like considered for inclusion in the document, please contact me directly. We will also be focusing the Expo meeting to work through these issues and lay the groundwork for the next revision of this document.
The following is the meeting agenda:
1. Discuss background and issues regarding IPC-6016.
2. Review any proposed changes to IPC-6016.
3. Assign action items.
If you have not yet registered for Expo, now is the time to do so. Please visit www.ipcprintedcircuitsexpo.org for further information or to register on-line.
Thank you for your attention to this matter, and we look forward to seeing you in San Diego.
Best regards,
Chris Jorgensen
Chris Jorgensen
IPC
2215 Sanders Rd
Northbrook, IL 60062-6135
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-p- 847-790-5328
-f- 847-509-9700
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