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March 2000

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Subject:
From:
Jonathan A Noquil <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 3 Mar 2000 08:25:05 +0800
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text/plain (31 lines)
Hello guys,
about the Electroless Ni-P, we are experimenting this in one of our leadframes.
Is the P content affect the solderability of the material?
What about ductility? It seems that after forming the leads, big cracks @ the
bent lead radius were seen.
Does the grain size structure of the material affect this one? Which would be
better small grain size or big?
How to control the size?

After subjecting the material to different series of processing temperatures,
how it affects the property of the Ni-P.
Does annealing resolve this one?

Appreciate your technical expertise

Domo arigatou

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