My interpretation is that the requirement to not enter the bend or flex
transition area is in addition to the base acceptability measurement of
wicking at the edge of the coverlay. In other words, if it enters the
bend or flex transition area at all it's not acceptable.

Based on extensive testing experience, this interpretation is consistent
with the principles I laid out on page three of Rogers Technical
Bulletin TB 3026CA, Maximizing Flex Life in Flexible Printed Circuits.
(see http://www.rogers-corp.com/cmu/pdf/proprty1.pdf )


Andy Magee - Flex Guru
Senior Consultant - Bourton Group
[log in to unmask]
(815) 490-7593

Rick wrote,

I need some enlightenment/help. IPC-A-600F Section 4.1.7 addresses
solder wicking under the coverlay of flex circuits. The paragraph at the
top states migration does not extend into the bend or flex transition
area. Would this be the area where your measurements for acceptability
begin or does the measurement start at the clearance in the coverlay? No
one at IPC can answer this and they are waiting for their expert, Don
Dupriest (Lockheed) to return their call. Don if you are out there
please call me (505)345-5591 X3064.
Thanks in advance,
Rick Howieson
GTC

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