Hi Jonathan and Tech Net,

You mean Si wafers right?

Check with http://www.semiconductor.net
Semiconductor International magazine's website.

And also check out this 1997 Applied Materials press release.

APPLIED MATERIALS ANNOUNCES ADVANCEMENT IN ALUMINUM PLANARIZATION TECHNOLOGY

New Aluminum Low Pressure Seed (ALPS™) Chamber Enables Cost-Effective, High
Performance Via Fill for 0.25 micron Memory Devices 

http://www.appliedmaterials.com/newsroom/pr-00099.html

Hans

~~~~~~~~~~~~~~~~~~~
Hans M. Hinners
Materials (Process & Manufacturing) Engineer
Warner Robins Air Logistics Center
Avionics Production Division
Manufacturing Branch
380 Second Street, Suite 104
Building: 640, Mail Stop: LYPME
Robins AFB, GA 31098-1638
Voice: (912) 926 - 1970 Fax: (912) 926 - 7164
mailto:[log in to unmask]
http://www.robins.af.mil


-----Original Message-----
From: Jonathan A Noquil [mailto:[log in to unmask]]
Sent: Tuesday, March 28, 2000 7:53 AM
To: [log in to unmask]
Subject: Re: [TN] sputtering


Hello intellectual people out there!



does anybody knows a  company who is doing sputtering on wafers to make the
Al
      surface solderable?

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