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March 2000

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Subject:
Re: laminate stress relief
From:
Franklin Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 24 Mar 2000 11:56:59 -0800
Content-Type:
text/plain
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Timothy,

Baking? We're supposed to be baking that stuff?

Franklin


----- Original Message -----
From: Timothy Reeves <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, March 24, 2000 9:53 AM
Subject: [TN] laminate stress relief


Good Day, TechNet!
board fabs: what (if any) baking of incoming core material do you do to
minimize movement of layers. We try to have the material at 250°F for one
hour based on what someone told us quite a while back. Without going through
a big DOE, I'd like to ascertain if that's enough.
Danke schön.

Timothy Reeves
ECD Circuit Board Division
13626 South Freeman Road
Mulino, OR 97042
[log in to unmask]
(503) 829-9108 (800) 228-8198  FAX (503) 829-5482

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