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March 2000

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Subject:
From:
"Dr. Mathias Nowottnick" <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Tue, 7 Mar 2000 17:22:43 +0100
Content-Type:
text/plain
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text/plain (27 lines)
Dear David
In principle you are right. But sometimes it will be possible to solder
also below the liquidus temperature. Indeed the amount of solid phase of
SnCu2 at 235°C will be only in the range of 2% in the melt. You can
calculate that by the lever rule with the phase diagram for different
temperatures and compositions. From experience I can confirm, that we
have soldered successful with a SnCu3 alloy at 240°C. But I like to
concede, that this must not work for all assemblies.

sincerely
Mathias Nowottnick
Group Manager Joining Technology
Fraunhofer Institute IZM

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