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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 14 Mar 2000 17:16:11 -0800 |
Content-Type: | text/plain |
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I'm still wondering what the application is. Why would you want only 6-10
microinches of gold unless you're wire bonding and you need soft gold, where
immersion Au is just right? If it's an application that needs hard gold, why
only 6-10 microinches?
> ----------
> From: Hollandsworth, Ron
> Sent: Tuesday, March 14, 2000 10:18
> Subject: Gold Removal
>
> Rick Howieson & Others:
> Rick, you ask how thick our gold was . . . I misled everyone in the type
> of
> plating . . . it's not immersion but rather electroplating. Our spec is
> 6-10 and we are getting or got, 20-30 on some boards. These are the
> boards
> we would like to remove some gold if possible.
>
> I understand that electroplating your thickness depends on time rather
> than
> ion for ion in immersion plating.
>
> Thanks
> Ron
>
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