TECHNET Archives

March 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Timothy Reeves <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 Mar 2000 17:16:11 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (41 lines)
I'm still wondering what the application is. Why would you want only 6-10
microinches of gold unless you're wire bonding and you need soft gold, where
immersion Au is just right? If it's an application that needs hard gold, why
only 6-10 microinches?


> ----------
> From:         Hollandsworth, Ron
> Sent:         Tuesday, March 14, 2000 10:18
> Subject:      Gold Removal
>
> Rick Howieson & Others:
> Rick, you ask how thick our gold was . . . I misled everyone in the type
> of
> plating . . . it's not immersion but rather electroplating.  Our spec is
> 6-10 and we are getting or got, 20-30 on some boards.  These are the
> boards
> we would like to remove some gold if possible.
>
> I understand that electroplating your thickness depends on time rather
> than
> ion for ion in immersion plating.
>
> Thanks
> Ron
>

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################

ATOM RSS1 RSS2