Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 6 Mar 2000 08:07:43 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Another is Chepaume Industries in New York
315/768-7001
www.chepaume.com
> -----Original Message-----
> From: Ryan Grant [SMTP:[log in to unmask]]
> Sent: Monday, March 06, 2000 7:04 AM
> To: [log in to unmask]
> Subject: Re: [TN] Spec for "Lumps" on PCB
>
> Mordechai,
> The name of the company that holds the electroforming patent is
> AMTX. http://www.amtx.com . I believe PhotoStencil has some agreement
> with AMTX to manufacture stencils by electroforming as well. There may be
> others.
>
> Good luck
> Ryan G.
>
> > -----Original Message-----
> > From: Mordechai Holtzman [SMTP:[log in to unmask]]
> > Sent: Saturday, March 04, 2000 6:43 AM
> > To: [log in to unmask]
> > Subject: Re: [TN] Spec for "Lumps" on PCB
> >
> > Guys and Madams
> > Please I am looking for CO that are producing stencils by electroforming
> I
> > have recently achieved a great uniformity across the stencil with
> reduced
> > stress and a complete flat surface any info will be great. The metal
> that
> > was
> > electroformed is Nickel and the techniqe is Complex Wave Form- Pulse
> > Reverse.
> > Thanks
> > Moti
> >
> > President/CEO
> > A.S.E.T Inc.
> > 6804 NW 20 Ave
> > Ft. Lauderdale, Florida 33309
> > pH 954 984 5130
> > Fax 954 984 5139
> > E-mail: [log in to unmask]
> >
> > ##############################################################
> > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> > ##############################################################
> > To subscribe/unsubscribe, send a message to [log in to unmask] with
> > following text in
> > the body:
> > To subscribe: SUBSCRIBE TECHNET <your full name>
> > To unsubscribe: SIGNOFF TECHNET
> > ##############################################################
> > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> > additional
> > information.
> > If you need assistance - contact Keach Sasamori at [log in to unmask] or
> > 847-509-9700 ext.5315
> > ##############################################################
>
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> ##############################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in
> the body:
> To subscribe: SUBSCRIBE TECHNET <your full name>
> To unsubscribe: SIGNOFF TECHNET
> ##############################################################
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information.
> If you need assistance - contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> ##############################################################
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################
|
|
|