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Date: | Sun, 5 Mar 2000 12:05:17 -0000 |
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Good thought, but it wasn't, it was a new development involving XXXXXXXXXXXXXXXX. !!
Mike
----- Original Message -----
From: Creswick <[log in to unmask]>
To: <[log in to unmask]>
Sent: Sunday, March 05, 2000 4:06 AM
Subject: Re: [TN] Color of ceramic BGA's
> In acknowledgement to Mike Fenner's response on this subject on Feb 29th -
>
> It is possible the blue ceramic material you witnessed was a DuPont Low
> Temperature Co-Fired Ceramic (LTCC) tape material.
>
> We use it extensively, and have no problem with automatic wire bonders
> discerning reference points on the 'ceramic'.
>
> Our wireless component customers have used many boxcar loads of this
> product, but I can not confirm the type of alignment mechanism utilized
> (some are BGA-like attachment, while others utilize peripheral attachments
> similar to leadless ceramic chip carriers). However, receiving no
> complaints is usually a good sign.
>
> Am currently working with Philips ACM equipment on flip chip placement on
> the blue LTCC substrate. If I have a problem - surely you will hear the
> scream from there!
>
> Steven Creswick
> CTS RF Integrated Modules
> W. Lafayette, IN 47906
>
> Ph (765) 463 2565
>
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