Sender: |
|
X-To: |
|
Date: |
Fri, 31 Mar 2000 10:04:27 -0800 |
Reply-To: |
|
Subject: |
|
MIME-Version: |
1.0 |
Content-Transfer-Encoding: |
7bit |
Content-Type: |
text/plain; charset=us-ascii |
From: |
|
Parts/Attachments: |
|
|
Rick Babyak wrote:
> Is there any acceptance criteria or a spec out there that covers via
> plugging with mask/ink?
>
> Rick Babyak
> Process Engineer
> Proto Circuit Inc.
> 7 Ascot Parkway
> Cuyahoga Falls, OH 44223
> 330-572-3401 Fax:330-572-3434
> [log in to unmask]
>
Rick,
The IPC has begun such an effort. The Plugged Via Performance Task Group (D-33d) is
scheduled to meet at the Expo in San Diego next Wednesday from 1:30-3:00 pm according
to my program schedule. The program states "This task group will develop acceptance
criteria for protecting plated-through holes, blind and buried vias. The work of this
task group will be submitted to the Rigid Board Performance task group for inclusion in
the IPC-6012 B Revision." If you wish more information, contact me off-line and I'll
see if I can direct you to the proper IPC staff liaison and chairman of this task
group.
Brian McCrory
--
Delsen Testing Laboratories, Inc.
1024 Grand Central Ave.
Glendale, CA 91201
Phone: 818 247 4106
FAX 818 247 4537
email: [log in to unmask]
URL: http://www.delsen.com/
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################
|
|
|