 
| Sender: |
|
| X-To: |
|
| Date: |
Fri, 17 Mar 2000 14:54:26 EST |
| Reply-To: |
|
| Subject: |
|
| MIME-Version: |
1.0 |
| Content-Transfer-Encoding: |
7bit |
| Content-Type: |
text/plain; charset="US-ASCII" |
| From: |
|
| Parts/Attachments: |
|
|
Hi Rick,
Determining and maintaining reflow oven profiles for each assembly is a good
idea regardless of the the reflow method used (excepting vapor phase, of
course). While the heat transfer has improved with the 'Convection' ovens vs.
the 'IR' ovens, the size and thermal masses of components have gotten more
varied.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################
|
|
|
