There was definition provided several years ago regarding the use of "Hot
Bar/Heater Bar" for multileaded components in the mil specs since it was
sometimes used with flat pack component predecessors to the SMT world. See
MIL-STD-2000, Revision A, paragraphs 4.23.7.6 and 5.1.10. See also
"Resistance Reflow".
* Lead coplanarity is an issue due to lead lift from residual stress
retention.
* Heat properties did not require the component body to reach the reflow
temp.
* The process could be profiled.
* The lead Must be accessible.
* Etc..

I can provide you with the references if you need them.

Mel Parrish
ACI/EMPF
One International Plaza, Suite 600
Philadelphia, PA 19113
[log in to unmask]
www.empf.org
610 362 1200 x238
610 362 1290 Fax



-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of Gabriela Bogdan
Sent:   Monday, January 31, 2000 6:36 PM
To:     [log in to unmask]
Subject:        [TN] Hot Bar Soldering

Hi!
Could somebody comment on Hot Bar soldering methods?
-What are the requirements for coplanarity of leads?
-What are the PCB pads finish requirements?
- What flux to use and how to apply it (and clean it?)  if the component
is resistant only to alcohols and deionized water, and not hermetic?
I wonder if Aric Parr's comment about  not using no clean flux for touch
up is valid for Hot Bar too.
Thanks,
Gaby

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