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Date: | Thu, 3 Feb 2000 10:56:44 -0800 |
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Ed
If you are laser drilling the blind vias, the thinner foil can become
difficult. It can be done, but with care and some impact on throughput.
Carey
-----Original Message-----
From: Brunker Ed <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Thursday, February 03, 2000 6:03 AM
Subject: [TN] 5 MICRON FOIL
>We have PCBs with blind vias. The fabrication process goes through two
>plating processes so the outer layers are quite thick. To offset this, the
>PCB supplier has proposed the use of 5 micron foil instead of 15 micron on
>the outer layers to reduce the thickness of the copper. Are there any
>drawbacks from using a thinner foil?
>Regards
>Edward Brunker
>Principal Process Engineer
>
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