TECHNET Archives

February 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Carey Pico <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 3 Feb 2000 10:56:44 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (54 lines)
Ed

If you are laser drilling the blind vias, the thinner foil can become
difficult.  It can be done, but with care and some impact on throughput.

Carey

-----Original Message-----
From: Brunker Ed <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Thursday, February 03, 2000 6:03 AM
Subject: [TN] 5 MICRON FOIL


>We have PCBs with blind vias. The fabrication process goes through two
>plating processes so the outer layers are quite thick. To offset this, the
>PCB supplier has proposed the use of 5 micron foil instead of 15 micron on
>the outer layers to reduce the thickness of the copper. Are there any
>drawbacks from using a thinner foil?
>Regards
>Edward Brunker
>Principal Process Engineer
>
>##############################################################
>TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
>##############################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in
>the body:
>To subscribe:   SUBSCRIBE TECHNET <your full name>
>To unsubscribe:   SIGNOFF TECHNET
>##############################################################
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
>information.
>If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
>847-509-9700 ext.5365
>##############################################################
>

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2