Thanks for the help,  i will need all the luck i can get

                Bill

> ----------
> From:         rampinc[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;rampinc
> Sent:         Tuesday, February 01, 2000 6:58 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] BGA-Multi layer ceramic design
>
> Sullivan,
> Go to the following URL
> -http://developer.intel.com/design/packtech/packbook.htm#IntelTop
> You will find the help you are looking for. Good Luck.
>
> "Sullivan, William" wrote:
>
> > Fellow TechNeter's
> >
> >         I am in sort of a dilemma, I have been AR'ed to develop a design
> > process for BGA (multi layer ceramic) packages. Up to this point we have
> out
> > source the design and fabrication but this is very costly and turn times
> are
> > unacceptable in the semiconductor industry. I consider myself a seasoned
> PCB
> > designer with the proper EDA tools in place to aid me, but this is out
> of my
> > league at the present moment.  I could really use some help on gathering
> > design guide information,routing, and fabrication on these things. Or
> > possibly some one out there that is doing package design can contact me
> with
> > there phone number.
> >
> >         Thanks William Sullivan C.I.D
> >         Supervisor Probe Card Design
> >
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> --
> ____________________________________
> Regards,
> Pratap Singh
>
> Tel./Fax: 512-255-6820,
> e-mail: [log in to unmask] or [log in to unmask]
>
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