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February 2000

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Subject:
From:
Bogdan Gabi <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 3 Feb 2000 18:06:22 +0200
Content-Type:
text/plain
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> ----------
> From:         Bob Willis[SMTP:[log in to unmask]]
> Reply To:     Leadfree Electronics Assembly E-Mail Forum.;Bob Willis
> Sent:         ?éåí ùìéùé 01 ôáøåàø 2000? 16:44
> To:   [log in to unmask]
> Subject:      Re: [LF] Solderability test results obtained with lead-free
> alloy s
> 
> We hope the next edition of the Lead Free CookBook CD ROM will have
> results of solderability trials on lead free alloys with different surface
> coatings. It should also contain video clips of wetting tests which have
> already been done as examples of the test only.
>  
> As a side issue the boards used in the video filming were three years old
> OSP, gold over nickel and Silver using a standard test flux with very good
> results. During filming the only problem we had was a fly landing on one
> of the samples during test. This clip will not be on the Cookbook CD.
>  
> If any one wants the Bob Willis Solderability Fly video, goes down a storm
> at technical seminars, breaks up the technical bits. The clip is only 500K
> for use on PowerPoint presentations and its FREEE
>  
>  
> Bob Willis
>  
> Home Page: www.bobwillis.co.uk
> Tel: (44) 01245 351502
> Fax: (44) 01245 496123
> 
> ----- Original Message ----- 
> From: Michel Leuchtmann 
> To: [log in to unmask] 
> Sent: Tuesday, February 01, 2000 1:47 PM
> Subject: Re: [LF] Solderability test results obtained with lead-free alloy
> s
> 
> 
> Hello, 
> 
> You will find, on the Multicore site, 
> 
> http://www.multicore.com/default.htm 
> 
> an interesting report on their lead free solder, paste and wire. 
> 
> By following the lead-free links, you will reach the report
> http://www.multicore.com/datasheets/msl733.pdf in which is detailed (page
> 2) the wetting time of their ECOSOL lead-free solder compared to the
> Sn60Pb40.
> 
> A precedent Email in the IPC lead-free forum also gave this address: 
> 
> http://www.lead-free.org/ 
> 
> which contains an interesting cross table alloys/suppliers (quite
> extensive). Some suppliers probably have reports as you look for
> (Multicore do).
> 
> Regards. 
> 
> P.S.: I have no actions in Multicore. 
> 
> Michel Leuchtmann 
> Design for Environment 
> 
> Tel: 33 01 39 44 56 23, ESN 579 56 23 
> Fax: 33 01 39 44 50 16, ESN 579 50 16 
> 
>       -----Message d'origine----- 
> De:     Walter Huck [SMTP:[log in to unmask]] 
> Date:   mardi 1 février 2000 13:59 
> ?:      [log in to unmask] 
> Objet:  [LF] Solderability test results obtained with lead-free alloys 
> 
>       Dear colleagues, 
> our German standardization committee has lauched a task force to study the
> 
> influence of lead-free soldering processes to the content of existing
> standards, 
> especially those describing test methods and evaluation critieria for 
> solderability and resistance against soldering heat test. 
> 
>       Previous investigations have shown that there will be differences in
> wetting 
> behaviour compared to SnPb solder, which actually is used for these tests.
> 
> 
>       Has anybody already done such investigations, or has information or
> links to 
> reports etc. ? 
> 
>       Walter Huck, Murata Electronic 
> 
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