Sullivan,
Go to the following URL
-http://developer.intel.com/design/packtech/packbook.htm#IntelTop
You will find the help you are looking for. Good Luck.

"Sullivan, William" wrote:

> Fellow TechNeter's
>
>         I am in sort of a dilemma, I have been AR'ed to develop a design
> process for BGA (multi layer ceramic) packages. Up to this point we have out
> source the design and fabrication but this is very costly and turn times are
> unacceptable in the semiconductor industry. I consider myself a seasoned PCB
> designer with the proper EDA tools in place to aid me, but this is out of my
> league at the present moment.  I could really use some help on gathering
> design guide information,routing, and fabrication on these things. Or
> possibly some one out there that is doing package design can contact me with
> there phone number.
>
>         Thanks William Sullivan C.I.D
>         Supervisor Probe Card Design
>
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--
____________________________________
Regards,
Pratap Singh

Tel./Fax: 512-255-6820,
e-mail: [log in to unmask] or [log in to unmask]

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