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February 2000

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Subject:
From:
Brunker Ed <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 3 Feb 2000 13:57:26 -0000
Content-Type:
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text/plain (23 lines)
We have PCBs with blind vias. The fabrication process goes through two
plating processes so the outer layers are quite thick. To offset this, the
PCB supplier has proposed the use of 5 micron foil instead of 15 micron on
the outer layers to reduce the thickness of the copper. Are there any
drawbacks from using a thinner foil?
Regards
Edward Brunker
Principal Process Engineer

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