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February 2000

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 Feb 2000 20:15:37 +1100
Content-Type:
text/plain
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text/plain (82 lines)
This sounds very "interesting" from the configuration of the process
application view Rob.
Dispense head IS attached to the bond head ?;
I'd agree with you on your worries to be indeed in the head scratch category
.
From what you (so far) described Siamese dissection may be due .
But , you must have a pretty (not quite) good reasons (motion elimination?)
to go as far as integrating UV lamp into actual (automated, what
machine?)xyz enclosure.
Otherwise it's a cool solution to double the fly function of Z dispense head
as UV carrier (& a clamp!)as well,
(only swedes with their modular design school could do as well).
Impressive .
Hey Rob ; we can perhaps screen it by various means , pending the machine,
path program, etc.
and i care little if you'd like it off or on line ,
it entails tedious (verbal) or quick (pdf) connection .

Let's see if anybuddy else (last time seen with messy green message, very
experienced in those things) bites .
Picture (or thousands words) would help .
Or draft the configuration over a fax (+61 2 9878 5079).

cu

paul (libra with gemini)
http://www.resmed.com


-----Original Message-----
From: rob mewes [mailto:[log in to unmask]]
Sent: Tuesday, 29 February 2000 18:43
To: [log in to unmask]
Subject: [TN]


Hi Technetters,
  Does anyone have any experience they could pass on
regarding the automatic dispensing of UV cure epoxy.
I am trying to dispense onto a substrate and then
whilst holding the component being bonded in place
with the bond head cure the material.  My only problem
is that the dispense head is attached to the bond head
and I am worried about the UV material curing in and
around the needle.

Thanks

Bob Mewes
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