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February 2000

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Subject:
From:
rob mewes <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 28 Feb 2000 23:42:59 -0800
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Hi Technetters,
  Does anyone have any experience they could pass on
regarding the automatic dispensing of UV cure epoxy.
I am trying to dispense onto a substrate and then
whilst holding the component being bonded in place
with the bond head cure the material.  My only problem
is that the dispense head is attached to the bond head
and I am worried about the UV material curing in and
around the needle.

Thanks

Bob Mewes
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