Hi Mike!

We tried something for IL Inspect with Photoresist - contrast/reflectance
would have it though.

Hans

~~~~~~~~
Hans M. Hinners
Materials (& Process!) Engineer
Warner Robins - Air Logistics Center/Avionics Production Division
Manufacturing Branch (LYPME)
380 Second Street, Suite 104    (Building 640)
Robins AFB, GA  31098-1638
912-926-1970 (Voice) 468 - 1970 (DSN)  912-926-7164 (Fax)
mailto:[log in to unmask]



> -----Original Message-----
> From: Mike Bailey [SMTP:[log in to unmask]]
> Sent: Thursday, February 24, 2000 02:32
> To:   [log in to unmask]
> Subject:      [TN] Outerlayer AOI
>
> We recently changed AOI machines on which we do outerlayer inspection
> after
> etch.  The unit is reflective. The surface topography and reflectiveness
> of
> the copper plating cause many psuedo defects.  Has anyone had success with
> either a modification of the tin stripper chemistry or possible using an
> oxide process prior to scanning?
>
> Mike Bailey
> Director of Engineering
> McCurdy Circuits Inc.
> 4900 E. Hunter Ave.
> Anaheim, CA  92870
> Phone: 714 507-4900 Ext 253
> FAX: 714 507-4911
> e-mail: [log in to unmask] <mailto:[log in to unmask]>
>

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