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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 28 Feb 2000 13:23:29 -0500 |
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Hi Phillip,
We've been making stuff with double treat for a while and haven't run into
any delam trouble. You do need to watch the handling procedures -
protecting the panels from bare hands. Although when it does (rarely) occur
the smudges are quite apparent. On the plus side you get to skip the oxide
process.
Hans
~~~~~~~~
Hans M. Hinners
Materials (& Process!) Engineer
Warner Robins - Air Logistics Center/Avionics Production Division
Manufacturing Branch (LYPME)
380 Second Street, Suite 104 (Building 640)
Robins AFB, GA 31098-1638
912-926-1970 (Voice) 468 - 1970 (DSN) 912-926-7164 (Fax)
mailto:[log in to unmask]
> -----Original Message-----
> From: Spann, Phillip J (S3) [SMTP:[log in to unmask]]
> Sent: Tuesday, February 22, 2000 10:36
> To: [log in to unmask]
> Subject: [TN] Double treat copper
>
> We are a small PCB shop producing multilayer boards. Does anyone know
> any advantages or
> disadvantages in using double treated copper as opposed to standard
> "slick"
> copper for inner layers.
> We are concerned about boards delaminating after some time in the field.
> Currently we use standard
> FR4 with a slick finish and do not have any known problems with
> delamination, but are not 100% sure
> about the product over time. Thanks in advance for any input.
>
>
> Phillip Spann
>
> S3, Inc.
>
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