We recently changed AOI machines on which we do outerlayer inspection after
etch.  The unit is reflective. The surface topography and reflectiveness of
the copper plating cause many psuedo defects.  Has anyone had success with
either a modification of the tin stripper chemistry or possible using an
oxide process prior to scanning?

Mike Bailey
Director of Engineering
McCurdy Circuits Inc.
4900 E. Hunter Ave.
Anaheim, CA  92870
Phone: 714 507-4900 Ext 253
FAX: 714 507-4911
e-mail: [log in to unmask] <mailto:[log in to unmask]>

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