Hi Technetters,

We have now started dipping our boards, this is a BIG step down for you
guys, BUT, its a big step up for us.

The thing is the boards are giving us severe bridging problems.

We are using Kester 63/37 solder and, #971 flux, foamed, with OSP coated
boards.

The pot is set at 460, and we have tried hotter and cooler, with the same
result.

There is a film that forms almost instantly on the surface of the moten
solder which I think is the source of the problem, would working under
nitrogen help to eliminate this? In fact is blanketing with nitrogen a
viable solution?

HELP!!!


END --------------------- [log in to unmask] END

    "The Web brings people together, because, no matter what kind of
    a twisted sexual mutant you happen to be, you've got millions of
    pals out there. Type in  - 'Find people that have sex with goats
    that are on fire', and the computer will say, - 'Specify type of
    goat.'"                                             Richard Jeni

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################