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February 2000

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 2 Feb 2000 17:42:59 EST
Content-Type:
text/plain
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n a message dated 02/02/2000 1:29:36 PM Central Standard Time,
[log in to unmask] writes:

<< Fellow technetter's

         Can anyone tell me which package (BGA or PGA) has better electrical
 characteristics from the other and why.

thanks Bill >>

Hi Bill!

Go to: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html and
you'll find a pretty good cross section of information about the aspects of
BGA technology.
Below is a table that lists various aspects in comparing other packages with
each other. This table came from that page:

                    PGA             CBGA            QFP
------------------------------------------------------------------------------
---------------------------------------
Size                43.5 x 43.5 mm  21 x 21mm       26 x 26 mm
I/Os                196                 324             256
Type I/O            Pins                Pads            Leads
Pitch               0.394mm         1.0mm           0.4mm
Signal-Signal Cap   1.43pF              0.40pF          --
Signal-GND Cap  6.76pF              1.85pF          1.78pF
Signal Inductance   8.57nH              3.26nH          20.31nH
Ground Inductance   ---                 0.76nH          ---
____________________________________________________________________
    Table 1-2. BGA Package Performance Comparisons
                    Source: IBM

Also in John Lau's book; "Ball Grid Array Technology" chapter 7 page 220,
there is a statement; "For electrical management, BGA packages have much
better electrical performance than PQFP or PGA. The inherent small package
size of BGA not only gives shorter package delay, but also gives short
package-to-package delay at the system level."

Hope you find this useful...

-Steve Gregory-

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