Fellow TechNeter's

        I am in sort of a dilemma, I have been AR'ed to develop a design
process for BGA (multi layer ceramic) packages. Up to this point we have out
source the design and fabrication but this is very costly and turn times are
unacceptable in the semiconductor industry. I consider myself a seasoned PCB
designer with the proper EDA tools in place to aid me, but this is out of my
league at the present moment.  I could really use some help on gathering
design guide information,routing, and fabrication on these things. Or
possibly some one out there that is doing package design can contact me with
there phone number.

        Thanks William Sullivan C.I.D
        Supervisor Probe Card Design

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