Hi Tarlach,
In response to your question IPC-2221 section 9.0 "Holes/Interconnections"
through 9.2 "Holes" can answer your questions.
Rgds,
Mike

-----Original Message-----
From: Tarlach FitzGerald [mailto:[log in to unmask]]
Sent: Wednesday, February 23, 2000 3:09 AM
To: [log in to unmask]
Subject: [TN] Pad to lead size ratio's


Good Morning Techies,

I have a question for all of the standards buffs out there!  Is there a
current
standard, or an industry formulae, that discusses the relationship between
the
pad area on a PCB and lead size/area of the component to be soldered to it?
Is
there a set minimum pad area for certain components that will allow
reasonable
joint strength?

Thanks for any comments in advance.

Regards,

Tarlach.

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