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February 2000

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Subject:
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 23 Feb 2000 16:28:26 +0100
Content-Type:
text/plain
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text/plain (24 lines)
Ed

The idea of the underfill is to force the FR4 to deform not more than the
BGA. You must do the same if you want to mount a flipchip on FR4. Not very
elegant but effective.

Best regards

Guenter

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