TECHNET Archives

February 2000

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Pad to lead size ratio's
From:
Jim Bergenthal/MKT/HQ/KEMET/US <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 23 Feb 2000 07:48:03 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (67 lines) 
IPC- SM-  782 A.




Tarlach FitzGerald <[log in to unmask]>@IPC.ORG> on 02/23/2000
05:09:02 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to [log in to unmask]

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:
Subject:  [TN] Pad to lead size ratio's


Good Morning Techies,

I have a question for all of the standards buffs out there!  Is there a
current
standard, or an industry formulae, that discusses the relationship between
the
pad area on a PCB and lead size/area of the component to be soldered to it?
Is
there a set minimum pad area for certain components that will allow
reasonable
joint strength?

Thanks for any comments in advance.

Regards,

Tarlach.

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2