Good Morning Techies,

I have a question for all of the standards buffs out there!  Is there a current
standard, or an industry formulae, that discusses the relationship between the
pad area on a PCB and lead size/area of the component to be soldered to it?   Is
there a set minimum pad area for certain components that will allow reasonable
joint strength?

Thanks for any comments in advance.

Regards,

Tarlach.

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