Does anyone have a good procedure that I could use to apply dye penetrant
to detect cracks in BGA connections?
Or is this type of testing better off left to the experts at a test lab?

We have some test vehicle circuit cards which are failing electrically test
after subjecting them to thermal shock cycles.

The failures are no longer intermittent at room temperature so I don't
expect to find just microcracking, but I don't want to just rip the
component off either.

These are test vehicles on which we hoped to determine how close to a BGA
that hardware (screws) attaching the circuit card to a chassis can be
placed without deleterious effects as well as to determine the effect of a
compressive thermal transfer sheet material on the BGA connections.

Any information would be appreciated.

Phil Bavaro

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