i'd concur with the "do not bend" notions,
but from learning the hard way episode
(changed to M-tron mil specked smd can from unmentionable thai fab
obscurity),
there is something else at play (discussed 1/2 year back here).

It's a shock/jar/nock/whatever ; the crystal can take only a few G's on
mounted tips,
before the tip shatters. Nock of board on edge over table is sufficient with
some brands,
as we validated (they even go to field , before they droll off completely
upon subsequent motions).
There is plenty of good smd's on market (M-tron i can speak of , after 6
months validations),
no excuses for Dilbert's prepping .

What 'm trying to say (in written English, hope) ; often this fragile factor
(generated alongside of the process),
distorts the say: prepping analysis .
Dropping a bag of crystals prior on concrete in store does not help.

Paul Klasek
ResMed

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Tuesday, 22 February 2000 8:33
To: [log in to unmask]
Subject: [TN] ASSY: PTH -> SMT


Lately I have been seeing failure analysis that indicates the failures
were caused by trying to take a through hole component and bending
the leads up and around or under the component body to make it
a surface mount component.  In one case a crystal seal was broken
and another the bends were just too "springy".

Is there a set of suggestions as to how and when and IF this can be
done to a through hole component?

Susan Mansilla
Technical Director
Robisan Lab

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