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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 22 Feb 2000 12:24:36 -0500 |
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Susan, The only place I have seen it to be acceptably done was on page #20
of J-STD-001 (or similar method). I have seen other things, but they were
mostly too horrible to describe.
Ron Dieselberg
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, February 21, 2000 16:33
To: [log in to unmask]
Subject: [TN] ASSY: PTH -> SMT
Lately I have been seeing failure analysis that indicates the failures
were caused by trying to take a through hole component and bending
the leads up and around or under the component body to make it
a surface mount component. In one case a crystal seal was broken
and another the bends were just too "springy".
Is there a set of suggestions as to how and when and IF this can be
done to a through hole component?
Susan Mansilla
Technical Director
Robisan Lab
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