Lately I have been seeing failure analysis that indicates the failures
were caused by trying to take a through hole component and bending
the leads up and around or under the component body to make it
a surface mount component.  In one case a crystal seal was broken
and another the bends were just too "springy".

Is there a set of suggestions as to how and when and IF this can be
done to a through hole component?

Susan Mansilla
Technical Director
Robisan Lab

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